Contact us at :

46-1st & 2nd Floor,
PSRN Bayan Indah,
Sungai Nibong,
11900 Bayan Lepas,
Penang, Malaysia

Telephone:
604-6432300

Fax:
604-6432180

email : support@values1.com

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Do you have Die Bonders/Sorters in your plant that do not support inkless wafer processing capabilities?
Equipment that still rely on ink-dot recognition to separate good dies from bad? In the past, you would have only 2 choices : return to O.E.M. and be held captive to the price tag that comes along with their service, or replace the equipment!

Now there is 3rd option : purchase the Inkless Conversion Kit, a new breakthrough product that adds wafermap processing capability to your existing Die Bonder/Sorter  without impacting its control system or process capability, and at only a fraction of the O.E.M. price, which translates to significant savings!

Inkless Wafermap

Benefits of the Inkless Conversion Kit: Supports any Die Bonder/Sorter model! No change to equipment control system. Quick to set up. Provides real-time display of actual die picked on wafermap. Add-on electronics ensure accuracy. Allows current process to be used for linked wafers as well as inkless wafers. SECS2 (HSMS) Interface to Host. Unlimited wafermap converter support. Partial/Broken wafer editing support.

Call or write us for a free assessment of what we can do for your particular brand of equipment.........